Semiconductor device including storage capacitor with...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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Details

C257S301000, C257S310000, C257S353000, C257SE27092

Reexamination Certificate

active

08067793

ABSTRACT:
A method for manufacturing a semiconductor device with high response speed and high reliability. In the method for manufacturing a semiconductor device of the invention, a bonding layer is formed over a substrate, an insulating film and a storage capacitor portion lower electrode are formed over the bonding layer, a single crystal silicon layer is formed over the insulating film, a storage capacitor portion insulating film is formed over the storage capacitor portion lower electrode, a wiring is formed over the storage capacitor portion insulating film, a channel forming region and a low concentration impurity region are formed over the single crystal silicon layer, and a gate insulating film and a gate electrode are formed over the single crystal silicon layer. The storage capacitor portion insulating film is formed by depositing a YSZ film with a single crystal silicon layer used as a base film, whereby the permittivity increases and thus the leakage current from the storage capacitor portion is suppressed.

REFERENCES:
patent: 6372609 (2002-04-01), Aga et al.
patent: 7119365 (2006-10-01), Takafuji et al.
patent: 7755113 (2010-07-01), Yamazaki et al.
patent: 2002/0055206 (2002-05-01), Zhang
patent: 2003/0215996 (2003-11-01), Putkonen
patent: 2004/0065882 (2004-04-01), Yamazaki et al.
patent: 2008/0248629 (2008-10-01), Yamazaki et al.
patent: 2009/0075456 (2009-03-01), Akimoto et al.
patent: 05-109629 (1993-04-01), None
patent: 11-163363 (1999-06-01), None

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