Semiconductor pressure sensor, method for producing the...

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Physical deformation

Reexamination Certificate

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C257S419000, C257SE27006

Reexamination Certificate

active

07829960

ABSTRACT:
A semiconductor pressure sensor includes: a first substrate; a buried insulating film laminated on the first substrate; a second substrate laminated on the buried insulating film; a plurality of electrodes including a lower electrode and at least two upper electrodes, the lower electrode being formed on the second substrate; and a piezoelectric film laminated on the lower electrode and having the upper electrodes formed thereon. In the sensor, there is removed at least a portion of a region of the first substrate corresponding to a region of the second substrate including the piezoelectric film and the electrodes.

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patent: 7057248 (2006-06-01), Sautter et al.
patent: 7071795 (2006-07-01), Inoue
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patent: 2007-108161 (2007-04-01), None
patent: WO2007/032259 (2007-03-01), None

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