Method and system for memory thermal load sharing using...

Details Method and system for memory thermal load sharing using... Method and system for memory thermal load sharing using...

2007-12-28

2010-10-12

Nguyen, VanThu (Department: 2824)

Static information storage and retrieval

Read/write circuit

Differential sensing

C365S212000, C326S030000

Reexamination Certificate

active

07813204

ABSTRACT:
Memory component temperature information is used to implement a method for ODT (on die termination) thermal load management. A respective temperature of a plurality of memory components are accessed, and based on this temperature, an ODT cycle is directed to a first of the memory components to avoid imposing a thermal load from the ODT cycle on a second of the memory components.

REFERENCES:
patent: 5237460 (1993-08-01), Miller et al.
patent: 6523102 (2003-02-01), Dye et al.
patent: 6545684 (2003-04-01), Dragony et al.
patent: 6704022 (2004-03-01), Aleksic
patent: 6772352 (2004-08-01), Williams et al.
patent: 6832177 (2004-12-01), Khandekar et al.
patent: 6980020 (2005-12-01), Best et al.
patent: 7034565 (2006-04-01), Lee
patent: 7061640 (2006-06-01), Maeda
patent: 7259585 (2007-08-01), Brinkman et al.
patent: 7453302 (2008-11-01), Le et al.
Johnson, Chris, “Graphics DDR3 On-Die Termination and Thermal Considerations.” Micron Designline, vol. 12, Issue 1. Rev. Apr. 1, 2003. 8 pgs.
Restriction Requirement Dated May 8, 2007; U.S. Appl. No. 10/973,519.
Office Action Dated Sep. 14, 2007; U.S. Appl. No. 10/973,519.
Notice of Allowance Dated Mar. 6, 2008; U.S. Appl. No. 10/973,519.
Notice of Allowance Dated Jul. 16, 2008; U.S. Appl. No. 10/973,519.
Notice of Allowance Dated Oct. 14, 2008; U.S. Appl. No. 10/973,519.

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