Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2008-05-09
2010-06-01
Landau, Matthew C (Department: 2813)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S106000, C438S160000, C438S443000
Reexamination Certificate
active
07727872
ABSTRACT:
A system for fabricating semiconductor components includes a semiconductor substrate, a thinning system for thinning the semiconductor substrate, an etching system for forming the substrate opening, and a bonding system for bonding the conductive interconnect to the substrate contact. The semiconductor component can be used to form module components, underfilled components, stacked components, and image sensor semiconductor components.
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Hembree David R.
Hiatt William M.
Wood Alan G.
Gratton Stephen A.
Landau Matthew C
Micro)n Technology, Inc.
Mitchell James M
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