Apparatus and method for producing semiconductor modules

Details Apparatus and method for producing semiconductor modules Apparatus and method for producing semiconductor modules

2007-07-20

2010-12-14

Zarneke, David A (Department: 2891)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

With attachment to temporary support or carrier

C257SE21499

Reexamination Certificate

active

07851334

ABSTRACT:
An apparatus and method for producing semiconductor modules is disclosed. One embodiment provides for bonding at least one semiconductor die onto a carrier including a support film strip, the support film having applied an adhesive layer to one of its surfaces to attach the semiconductor die, and a pressure tool to press the semiconductor die and the support film strip onto the carrier to permanently contact the at least one semiconductor die to the carrier.

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patent: 102004019567 (2006-01-01), None
patent: 1030349 (2004-07-01), None
Goebl et al., “Low temperature sinter technology, Die attachment for automotive power electronic applications”, Automotive Power Electronics, Jun. 21-22, 2006, Paris, pp. 1-5.

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