MEMS pressure sensor using area-change capacitive technique

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Physical deformation

Reexamination Certificate

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C257S419000, C257SE29324

Reexamination Certificate

active

07737514

ABSTRACT:
A micro-electro-mechanical system (MEMS) pressure sensor includes a silicon spacer defining an opening, a silicon membrane layer mounted above the spacer, and a silicon sensor layer mounted above the silicon membrane layer. The silicon membrane layer forms a diaphragm opposite of the spacer opening, and a stationary perimeter around the diaphragm and opposite the spacer. The silicon sensor layer includes a movable electrode and a stationary electrode separated by a substantially constant gap and respectively located above the diaphragm and the stationary perimeter of the silicon membrane layer. The movable electrode and the diaphragm move in response to a pressure applied to the diaphragm where an overlap area between sidewall surfaces of the movable and the stationary electrodes create a capacitance proportion to the pressure.

REFERENCES:
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patent: 7187185 (2007-03-01), Dallenbach et al.
patent: 7385744 (2008-06-01), Kogut et al.
patent: 2005/0076719 (2005-04-01), Jakobsen et al.
patent: 2006/0067651 (2006-03-01), Chui
patent: 2007/0216423 (2007-09-01), Grosjean et al.
patent: 2008/0029481 (2008-02-01), Kothari et al.
patent: 2008/0278788 (2008-11-01), Sasagawa
patent: 2009/0194827 (2009-08-01), Ogino et al.
Surface Micromachined Capacitive Differential Pressure Sensor with Lithographically-Defined Silicon Diaphragm. Mastragnelo et al. Solid-state Sensors and Actuators 1995 and Eurosensors IX Jun. 1995. vol. 1 pp. 612-615.

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