Patent
1990-03-23
1992-05-26
James, Andrew J.
357 74, 357 80, 357 65, H01L 2328, H01L 2302, H01L 2312
Patent
active
051172798
ABSTRACT:
A semiconductor device having a package sealed by a UV-curable, thixotropic, acrylated epoxy and a method for sealing the package are disclosed. The package is sealed at room temperature by polymer cross-linking of the epoxy which is initiated by exposure of at least a portion of the expoxy to ultraviolet (UV) frequency radiation. In accordance with one embodiment of the invention, a base is provided having an electronic component attached to the base at a predetermined location. A lid having a layer of UV-curable epoxy screen-printed to a bonding portion is positioned onto the base enclosing the electronic component within a cavity formed by the union of the base and the lid. The lid is sealed to the base at room temperature by irradiating an exposed edge portion of the epoxy layer with UV frequency radiation. The formation of the seal at room temperature avoids thermal damage to temperature sensitive materials in both the package and the enclosed electronic component.
REFERENCES:
patent: 4141055 (1979-02-01), Berry et al.
patent: 4480009 (1984-10-01), Berger
patent: 4783697 (1988-11-01), Benenati et al.
Dockrey Jasper W.
James Andrew J.
Jr. Carl Whitehead
Motorola Inc.
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