Wiring board and method for manufacturing the same

Details Wiring board and method for manufacturing the same Wiring board and method for manufacturing the same

2006-06-01

2010-06-08

Norris, Jeremy C (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C361S761000, C029S832000

Reexamination Certificate

active

07732712

ABSTRACT:
A wiring board includes: a semiconductor chip; an insulating layer in which the semiconductor chip is embedded; a wiring connected to the semiconductor chip; and reinforcing layers for reinforcing the insulating layer, the reinforcing layers respectively formed on a front face side of the insulating layer and a rear face side of the insulating layer.

REFERENCES:
patent: 4979076 (1990-12-01), DiBugnara
patent: 6239976 (2001-05-01), Templeton et al.
patent: 7420128 (2008-09-01), Sunohara et al.
patent: 2001-352007 (2001-12-01), None
patent: 2002-076637 (2002-03-01), None
patent: 2003-142628 (2003-05-01), None
patent: 2004-327624 (2004-11-01), None
patent: 2004-343021 (2004-12-01), None
patent: 2005/004567 (2005-01-01), None

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