Packaging conductive structure for a semiconductor substrate...

Details Packaging conductive structure for a semiconductor substrate... Packaging conductive structure for a semiconductor substrate...

2007-07-02

2010-02-02

Williams, Alexander O (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257SE23175, C257SE23146, C257SE23021, C257SE23031, C257SE21538, C257S734000, C257S677000, C257SE21495, C257SE21440, C257SE21477, C438S121000, C438S612000

Reexamination Certificate

active

07656020

ABSTRACT:
A packaging conductive structure for a semiconductor substrate and a method for forming the structure are provided. The dielectric layer of the packaging conductive structure partially overlays the metallic layer of the semiconductor substrate and has a receiving space. The lifting layer and conductive layer are formed in the receiving space, wherein the conductive layer extends for connection to a bump. The lifting layer is partially connected to the dielectric layer. As a result, the conductive layer can be stably deposited on the edge of the dielectric layer for enhancing the reliability of the packaging conductive structure.

REFERENCES:
patent: 5466637 (1995-11-01), Kim
patent: 5762259 (1998-06-01), Hubacher et al.
patent: 6107667 (2000-08-01), An et al.
patent: 6590295 (2003-07-01), Liao et al.
patent: 6756671 (2004-06-01), Lee et al.
patent: 7408181 (2008-08-01), Chang
patent: 2005/0130388 (2005-06-01), Suh
patent: 2005/0260794 (2005-11-01), Lo et al.
patent: 2007/0023925 (2007-02-01), Ke et al.
patent: 2008/0122078 (2008-05-01), He et al.
patent: 2008/0169539 (2008-07-01), Fang et al.
patent: 2008/0182401 (2008-07-01), Ke et al.
patent: 2008/0265413 (2008-10-01), Chou et al.

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