Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Reexamination Certificate
2007-05-23
2010-02-16
Chu, Chris C (Department: 2815)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Insulative housing or support
C438S108000, C438S117000, C438S123000, C257SE23070, C257S734000, C257S668000
Reexamination Certificate
active
07662673
ABSTRACT:
A semiconductor device including: a semiconductor substrate in which an integrated circuit is formed; an insulating layer formed on the semiconductor substrate and having a first surface and a second surface which is higher than the first surface; a first electrode formed to avoid the second surface and electrically connected to the inside of the semiconductor substrate; and a second electrode formed on the second surface and electrically connected to the inside of the semiconductor substrate.
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U.S. Appl. No. 10/829,146, filed Apr. 21, 2004, Nobuaki Hashimoto.
Chu Chris C
Hogan & Hartson LLP
Seiko Epson Corporation
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