System and method for modulation mapping

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

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Reexamination Certificate

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07733100

ABSTRACT:
An apparatus for providing modulation mapping is disclosed. The apparatus includes a laser source, a motion mechanism providing relative motion between the laser beam and the DUT, signal collection mechanism, which include a photodetector and appropriate electronics for collecting modulated laser light reflected from the DUT, and a display mechanism for displaying a spatial modulation map which consists of the collected modulated laser light over a selected time period and a selected area of the IC.

REFERENCES:
patent: 3524694 (1970-08-01), Klein et al.
patent: 3711186 (1973-01-01), O'Connor
patent: 3912378 (1975-10-01), Goto
patent: 4297032 (1981-10-01), Temple
patent: T102104 (1982-08-01), Kirk et al.
patent: 4353618 (1982-10-01), Hagner et al.
patent: 4555767 (1985-11-01), Case et al.
patent: 4588950 (1986-05-01), Henley
patent: 4615620 (1986-10-01), Noguchi et al.
patent: 4625114 (1986-11-01), Bosacchi et al.
patent: 4634234 (1987-01-01), Baumann
patent: 4680635 (1987-07-01), Khurana
patent: 4681449 (1987-07-01), Bloom et al.
patent: 4698587 (1987-10-01), Burns et al.
patent: 4721910 (1988-01-01), Bokor et al.
patent: 4724322 (1988-02-01), Knowles et al.
patent: 4736159 (1988-04-01), Shiragasawa et al.
patent: 4758092 (1988-07-01), Heinrich et al.
patent: 4758786 (1988-07-01), Hafeman
patent: 4811090 (1989-03-01), Khurana
patent: 4908568 (1990-03-01), Gerald
patent: 4956603 (1990-09-01), Russo
patent: 4968932 (1990-11-01), Baba et al.
patent: 5004307 (1991-04-01), Kino et al.
patent: 5010945 (1991-04-01), Burke
patent: 5087121 (1992-02-01), Kakuchi et al.
patent: 5208648 (1993-05-01), Batchelder et al.
patent: 5220403 (1993-06-01), Batchelder et al.
patent: 5247392 (1993-09-01), Plies
patent: 5282088 (1994-01-01), Davidson
patent: 5334540 (1994-08-01), Ishii
patent: 5412328 (1995-05-01), Male et al.
patent: 5430292 (1995-07-01), Honjo et al.
patent: 5430305 (1995-07-01), Cole et al.
patent: 5453994 (1995-09-01), Kawamoto et al.
patent: 5457536 (1995-10-01), Kornfield et al.
patent: 5475316 (1995-12-01), Hurley et al.
patent: 5493236 (1996-02-01), Ishii et al.
patent: 5532607 (1996-07-01), Inuzuka et al.
patent: 5532873 (1996-07-01), Dixon
patent: 5757193 (1998-05-01), Yu et al.
patent: 5767688 (1998-06-01), Takahashi et al.
patent: 5854804 (1998-12-01), Winer et al.
patent: 5872360 (1999-02-01), Paniccia et al.
patent: 5930588 (1999-07-01), Paniccia
patent: 5940545 (1999-08-01), Kash et al.
patent: 6057677 (2000-05-01), Wakana et al.
patent: 6072179 (2000-06-01), Paniccia et al.
patent: 6168311 (2001-01-01), Xiao et al.
patent: 6251706 (2001-06-01), Paniccia
patent: 6252412 (2001-06-01), Talbot et al.
patent: 6462814 (2002-10-01), Lo
patent: 6509750 (2003-01-01), Talbot et al.
patent: 6591121 (2003-07-01), Madarasz et al.
patent: 6594086 (2003-07-01), Pakdaman et al.
patent: 6605951 (2003-08-01), Cowan
patent: 6621275 (2003-09-01), Cotton et al.
patent: 6720588 (2004-04-01), Vickers
patent: 6727501 (2004-04-01), Fan et al.
patent: 6739511 (2004-05-01), Tsikos et al.
patent: 6778327 (2004-08-01), Pakdaman et al.
patent: 6788396 (2004-09-01), Stolte et al.
patent: 6797581 (2004-09-01), Vickers
patent: 6798562 (2004-09-01), Hakimi et al.
patent: 6812464 (2004-11-01), Sobolewski et al.
patent: 6836131 (2004-12-01), Cader et al.
patent: 6897664 (2005-05-01), Bruce et al.
patent: 6971791 (2005-12-01), Borden et al.
patent: 2006/0066325 (2006-03-01), McGinnis et al.
patent: 2006/0076503 (2006-04-01), Tsao
patent: 2006/0273263 (2006-12-01), Raymond et al.
Paniccia, Mario, et al., “Novel Optical Probing Technique for Flip Chip Packaged Microprocessors,” International Test Conference, IEEE 1998.
Eiles, Travis M., et al., “Optical Probing of VLSI IC's from the Silicon Backside,”Proceedings from the 25thInternational Symposium for Testing and Failure Analysis, Nov. 14-18, 1999, pp. 27-33.
Bruce, Mike, et al., “Waveform Acquisition from the Backside of Silicon Using Electro-Optic Probing,”Proceedings from the 25thInternational Symposium for Testing and Failure Analysis, Nov. 14-18, 1999, pp. 19-25.
Heinrich, H.K., et al., “Picosecond Backside Optical Detection of Internal Signals in Flip-Chip Mounted Silicon VLSI Circuits,”3rd European Conference on Electron and Optical Beam Testing of Integrated Circuits, Sep. 9-11, 1991, Como, Italy.
Black, A., et al., “Optical Sampling of GHz Charge Density Modulation in Silicon Bipolar Junction Transistors,” Electronics Letters, 1987, vol. 23, No. 15, p. 783-784.
Kasapi, Steven, et al., “Laser Beam Backside Probing of CMOS Integrated Circuits,”Microelectronics Reliability, 1999, pp. 957-961, 39.
Heinrich, H.K., et al., “Noninvasive Sheet Charge Density Probe for Integrated Silicon Devices,”Appl. Phys. Lett.48 (16), Apr. 21, 1986, American Institute of Physics.
Heinrich, H.K., et al., “Erratum: Noninvasive Sheet Charge Density Probe for Integrated Silicon Devices,”Appl. Phys. Lett.1986, 48, 1066.
Heinrich, H.K., et al., “Noninvasive Optical Sheet Charge Density Probe for Silicon Integrated Circuits,”IEEE Transactions on Electron Devices, Nov. 1986, vol. Ed. 33 No. 11.
Hemenway, B.R., et al., “Optical Detection of Charge Modulation in Silicon Integrated Circuits Using a Multimode Laser-Diode Probe,”IEEE Electron Device Letters, Aug. 1987, vol. EdL-8, No. 8.
Soref, Richard A., et al., “Electrooptical Effects in Silicon,”IEEE Journal of Quantum Electronics, Jan. 1987, vol. QE-23 No. 1.
Wilsher, Kenneth R., et al., “Practical Optical Waveform Probing of Flip-Chip CMOS Devices,”ITC International Test Conference, Paper 35.1, 1999.
Wilsher, Ken, et al., “Integrated Circuit Waveform Probing Using Optical Phase Shift Detection,”Proceedings from the 26thInternational Symposium for Testing and Failure Analysis, Nov. 12-16, 2000, pp. 479-485, Bellevue, Washington.
Lo, William, et al., “Polarization Difference Probing: A New Phase Detection Scheme for Laser Voltage Probing,”Proceedings from the 30thInternational Symposium for Testing and Failure Analysis, Nov. 14-18, 2004, Worcester, Massachusetts.
Heinrich, H.K., “Picosecond Noninvasive Optical Detection of Internal Electrical Signals in Flip-Chip-Mounted Silicon Integrated Circuits,”IBM J. Res. Development, Mar./May 1990, vol. 34. No. 2/3.
Mertin, W., et al., “Contactless Gigahertz Testing,” Gerhard-Mercator-Universität Duisburg, 1998.
Buller, G.S., et al., “All-Solid-State Microscope-Based System for Picosecond Time-Resolved Photoluminescence Measurements on II-VI Semiconductors,”Rev. Sci. Instrum.63 (5), May 1992, American Institute of Physics.
Charbonneau, S., et al., “Two-Dimensional Time-Resolved Imaging with 100-ps Resolution Using a Resistive Anode Photomultiplier Tube,”Rev. Sci. Instrum.,63 (11), Nov. 1992, American Institute of Physics.
Buller, G.S., et al., “Time-resolved Photoluminescence Measurements of InGaAs/InP Multiple-Quantum-Well Structures at 1.3-μm Wavelengths By Use of Germanium Single-Photon Avalanche Photodiodes,”Applied Optics, Feb. 20, 1996, pp. 916-921, vol. 35, No. 6.
Kudva, S.M., “The Sematech Failure Analysis Roadmap,”ISTFA '95, 21stInternational Symposium for Testing and Failure Analysis, Nov. 6-10, 1995, pp. 1-5, Santa Clara, California.
Restle, Philip, et al., “Internal Probing of Submicron FETs and Photoemission Using Individual Oxide Traps,”IBM Journal of Research and Development, Mar./May 1990, pp. 227-241, vol. 34, No. 2/3.
Cole, Edward I., JR., et al., “Novel Failure Analysis Techniques Using Photo Probing With a Scanning Optical Microscope,”IEEE/IRPS, 1994, pp. 388-398.
Esfahani, Farzad, et al., “Testability Improvement of Highly Integrated Circuits by Optical Injection of Logical Levels into the Circuit,” Institut für Mikroelektronik, Technische Universität Berlin, pp. 288-295, 1997.
Bergner, H., et al., “Dynamic Laser Beam Tes

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