Method of and apparatus for applying voltage to electrostatic ch

Electrical transmission or interconnection systems – Switching systems – Condition responsive

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361234, 361235, H02N 13000

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active

051171210

ABSTRACT:
A first voltage is first applied to the electrode or electrodes of an electrostatic chuck for electrostatically attracting a workpiece such as a silicon wafer. Then, before the workpiece is removed from the electrostatic chuck, a second voltage which is of opposite polarity to the first voltage is applied to the electrostatic chuck for eliminating a residual attractive force from the electrostatic chuck. The second voltage has a voltage value which is 1.5 to 2 times higher than the voltage value of the first voltage. The second voltage is continuously applied for a period of time which is in inverse proportion to the voltage value of the second voltage.

REFERENCES:
patent: 3983401 (1976-09-01), Livesay
patent: 3993509 (1976-11-01), McGinty
patent: 4184188 (1980-01-01), Briglia
patent: 4384918 (1983-05-01), Abe
patent: 4751609 (1988-06-01), Kasahara
patent: 4771358 (1988-09-01), Millner
Abstract of Japanese Patent Application No. 62-255039, dated Jun. 11, 1987, entitled "Releasing Method of Attracted Body from Electrostatic Attracting Device", from Patent Abstracts of Japan, vol. 12, No. 131 (M-688) [2978], dated Apr. 22, 1988.

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