Sputtering film forming method, electronic device...

Details Sputtering film forming method, electronic device... Sputtering film forming method, electronic device...

2008-04-16

2010-12-28

McDonald, Rodney G (Department: 1724)

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

C204S192130, C204S192150, C204S298030, C204S298180, C204S298230, C204S298260, C204S298280

Reexamination Certificate

active

07857946

ABSTRACT:
A sputtering film forming method. which positions a target4and5at an incline to a surface of a substrate10whereupon a film is to be formed, and forms the film upon the surface of the substrate10whereupon the film is to be formed in an incline direction while the substrate10is rotated about a normal axis, terminates the forming of the film at a predetermined timing from the commencement of the forming of the film, wherein the forming of the film is terminated, when the substrate has rotated by 360 degrees×n+180 degrees+α, where n is a natural number, including 0, and −10 degrees<α<10 degrees.

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