Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2006-07-18
2010-10-19
Geyer, Scott B (Department: 2812)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S099000, C438S677000
Reexamination Certificate
active
07816263
ABSTRACT:
Disclosed is a method for manufacturing a thin film transistor having high resolution and high pattern accuracy with high production efficiency. Particularly disclosed is a method for manufacturing a thin film transistor wherein there is prevented deterioration of semiconductor properties in a plating step for electrode formation. This method is characterized in that a source electrode or a drain electrode is formed by such a process wherein a protective film is formed on an organic semiconductor layer, then a plating catalyst pattern is formed thereon by supplying a liquid containing a plating catalyst, and then a plating agent is brought into contact with the pattern.
REFERENCES:
patent: 6452207 (2002-09-01), Bao
patent: 2005/0151195 (2005-07-01), Kawase et al.
patent: 2007/0004202 (2007-01-01), Fujii
patent: 2004-158805 (2004-06-01), None
patent: 2004-221573 (2004-08-01), None
Cohen Pontani Lieberman & Pavane LLP
Geyer Scott B
Konica Minolta Holdings Inc.
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