Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate
2008-01-24
2010-02-02
Clark, S. V (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
C257S701000
Reexamination Certificate
active
07656043
ABSTRACT:
A semiconductor package includes a semiconductor chip, a first substrate layer and a second substrate layer. The semiconductor chip has an active surface and a plurality of pads disposed on the active surface. The first substrate layer is formed on the active surface of the semiconductor chip and has a plurality of first contacts electrically connected to the pads of the semiconductor chip. The second substrate layer is substantially smaller than the first substrate layer, is formed on the first substrate layer, and has a plurality of second contacts electrically connected to the first contacts of the first substrate layer.
REFERENCES:
patent: 5903052 (1999-05-01), Chen et al.
patent: 6580618 (2003-06-01), Pu
patent: 6936930 (2005-08-01), Wang
patent: 7126209 (2006-10-01), Minamio et al.
patent: 7271476 (2007-09-01), Nishikawa et al.
patent: 7294928 (2007-11-01), Bang et al.
patent: 7344969 (2008-03-01), Tan et al.
patent: 7569922 (2009-08-01), Ogata
patent: 2002/0189091 (2002-12-01), Ding et al.
patent: 2006/0145339 (2006-07-01), Yang et al.
Advanced Semiconductor Engineering Inc.
Clark S. V
LandOfFree
Semiconductor package and method for manufacturing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor package and method for manufacturing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor package and method for manufacturing the same will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4206439