Semiconductor device and method of manufacturing the same

Registers – Records – Conductive

Reexamination Certificate

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C235S487000

Reexamination Certificate

active

07850087

ABSTRACT:
A semiconductor device and method of fabricating the same. The semiconductor device includes at least one first contact pin on a first substrate and at least one second contact pin on a second substrate. The at least one first and second contact pins may be included in first and second contact pin arrays. The first and second contact pins of the first and second contact pin arrays may be aligned.

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Korean Office Action dated Jul. 21, 2006 for Korean counterpart Application No. 10-2004-0103095 with English translation.

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