Semiconductor ferroelectric device, manufacturing method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S411000, C257S412000, C257S298000, C438S240000, C438S393000, C438S396000, C438S785000

Reexamination Certificate

active

07816716

ABSTRACT:
Source/drain diffusion layers and a channel region are formed in a polysilicon thin film formed on a substrate made of glass or the like, and furthermore, a gate electrode6is formed via a gate insulating film. A silicon hydronitride film is formed on the interlayer dielectric film, whereby the hydrogen concentration in an active element region including a switching thin film transistor can be maintained at a high level, and Si—H bonds in the silicon thin film become stable. In addition, by providing a ferroelectric film on the silicon hydronitride film via a lower electrode formed of a conductive oxide film, whereby the oxygen concentration of the ferroelectric capacitive element layer can be maintained at a high level, and generation of oxygen deficiency in the ferroelectric film is prevented.

REFERENCES:
patent: 2001/0019130 (2001-09-01), Yamazaki et al.
patent: 2001/0040249 (2001-11-01), Jung
patent: 2002/0021544 (2002-02-01), Cho et al.
patent: 2002/0024621 (2002-02-01), Hirakata et al.
patent: 2007/0111519 (2007-05-01), Lubomirsky et al.
patent: 4-85878 (1992-03-01), None
patent: 9-116159 (1997-05-01), None
patent: 10-242471 (1998-09-01), None
patent: 2002-334970 (2002-11-01), None

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