CMOS image sensor and method of fabricating the same

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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Details

C257S290000, C257S292000, C257SE27131, C438S435000, C438S221000, C438S210000, C438S218000, C438S222000

Reexamination Certificate

active

07838917

ABSTRACT:
A CMOS image sensor and method for fabricating the same, wherein the CMOS image sensor has minimized dark current at the boundary area between a photodiode and an isolation layer. The present invention includes a first-conductivity-type doping area formed in the device isolation area of the substrate, the first-conductivity-type doping area surrounding the isolation area and a dielectric layer formed between the isolation layer and the first-conductivity-type doping area, wherein the first-conductivity-type doping area and the dielectric layer are located between the isolation layer and a second-conductivity-type diffusion area.

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patent: 2004/0251481 (2004-12-01), Rhodes
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patent: 2004-369171 (2005-07-01), None
patent: 2001-0003139 (2001-01-01), None
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patent: WO 2004-081989 (2004-09-01), None

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