Structure for partitioned dummy fill shapes for reduced mask...

Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C716S030000

Reexamination Certificate

active

07861208

ABSTRACT:
A design structure, method, and system for partitioned dummy fill shapes for reduced mask bias with alternating phase shift masks, or with other two-mask lithographic processes employing a trim mask. A design structure is embodied in a machine readable medium used in a design process, the design structure comprising regions in a finished semiconductor design that do not contain as-designed shapes. The design structure additionally includes dummy fill shapes in the regions at a predetermined final density, wherein the generated dummy shapes are sized so that their local density is increased to a predetermined value. Moreover, corresponding trim shapes act to expose an oversized portion of the dummy shape, effectively trimming each dummy shape back to the predetermined final density.

REFERENCES:
patent: 5032890 (1991-07-01), Ushiku et al.
patent: 5537648 (1996-07-01), Liebmann et al.
patent: 5636131 (1997-06-01), Liebmann et al.
patent: 5763955 (1998-06-01), Findley et al.
patent: 5932563 (1999-08-01), Stokes et al.
patent: 6057063 (2000-05-01), Liebmann et al.
patent: 7383521 (2008-06-01), Smith et al.
patent: 2003/0106037 (2003-06-01), Moniwa et al.
patent: 2003/0229875 (2003-12-01), Smith et al.
patent: 2004/0110069 (2004-06-01), Lercel et al.
patent: 2005/0031972 (2005-02-01), Cote et al.
patent: 2005/0114824 (2005-05-01), Wang et al.
patent: 2005/0153212 (2005-07-01), Lavin et al.
patent: 2007/0166887 (2007-07-01), Chen et al.
patent: 2008/0086714 (2008-04-01), Faure et al.
patent: 2008/0203589 (2008-08-01), Bailey et al.
Office Action in U.S. Appl. No. 11/539,204, dated Apr. 1, 2009.
Lee et al, “Using Smart Dummy Fill and Selective Reverse Etchback for Pattern Density Equalization”, Proc. CMP-MIC, Mar. 2000, pp. 255-258.
Notice of Allowance in U.S. Appl. No. 11/539,204, dated Dec. 17, 2009.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Structure for partitioned dummy fill shapes for reduced mask... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Structure for partitioned dummy fill shapes for reduced mask..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Structure for partitioned dummy fill shapes for reduced mask... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4189038

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.