Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Reexamination Certificate
2009-02-13
2010-02-02
Walke, Amanda C. (Department: 1795)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
C430S281100, C430S282100, C430S283100, C430S284100, C430S286100, C430S287100, C430S285100, C524S877000, C524S878000, C524S876000
Reexamination Certificate
active
07655380
ABSTRACT:
Polymeric material, containing a latent acid which can be converted to an acid by irradiation by a laser and optionally further ingredients.
REFERENCES:
patent: 4343885 (1982-08-01), Reardon, Jr.
patent: 4485139 (1984-11-01), Watanabe et al.
patent: 4631084 (1986-12-01), Sagawa
patent: 5677107 (1997-10-01), Neckers
patent: 5879855 (1999-03-01), Schadeli et al.
patent: 6589641 (2003-07-01), Stirniman et al.
patent: 6635400 (2003-10-01), Kato et al.
patent: 6713612 (2004-03-01), Kobayashi et al.
patent: 6787591 (2004-09-01), Koch et al.
patent: 6855466 (2005-02-01), Pavelchek et al.
patent: 2004/0038149 (2004-02-01), Murakami et al.
patent: 2005/0015124 (2005-01-01), Irwin
patent: 0290750 (1988-11-01), None
patent: 0600441 (1994-06-01), None
patent: 0720053 (1996-07-01), None
Heat sensitive recording material (in Research Disclosure Database No. 433039), May 2000.
Office Search Report, Aug. 2007.
Ciba Specialty Chemicals Corporation
Loggins Shiela A.
Walke Amanda C.
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