Method of fabricating micro-electromechanical system...

Details Method of fabricating micro-electromechanical system... Method of fabricating micro-electromechanical system...

2008-09-15

2010-12-14

Garber, Charles D (Department: 2812)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

C257S614000, C257SE29324, C381S335000, C381S347000, C381S355000, C381S175000, C381S375000

Reexamination Certificate

active

07851247

ABSTRACT:
A method of fabricating a micro-electromechanical system microphone structure is disclosed. First, a substrate defining a MEMS region and a logic region is provided, and a surface of the substrate has a dielectric layer thereon. Next, at least one metal interconnect layer is formed on the dielectric layer in the logic region, and at least one micro-machined metal mesh is simultaneously formed in the dielectric layer of the MEMS region. Therefore, the thickness of the MEMS microphone structure can be effectively reduced.

REFERENCES:
patent: 6943448 (2005-09-01), Gabriel
patent: 7081647 (2006-07-01), Mushika
patent: 7202101 (2007-04-01), Gabriel
patent: 2003/0210799 (2003-11-01), Gabriel et al.

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