Method of arranging solder balls for ball grid array packages

Details Method of arranging solder balls for ball grid array packages Method of arranging solder balls for ball grid array packages

2007-07-11

2010-02-23

Le, Dung A. (Department: 2818)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S612000, C438S508000

Reexamination Certificate

active

07666778

ABSTRACT:
A method of arranging solder balls in a hexagonal array on an integrated circuit package is disclosed. Arranging the solder balls in a hexagonal array may increase the solder ball density, reducing solder ball fatigue. In some embodiments, the solder balls are arranged in the hexagonal array under the die shadow and in an orthogonal array outbound of the die shadow.

REFERENCES:
patent: 6268568 (2001-07-01), Kim
patent: 2004/0036176 (2004-02-01), Singh et al.

Affiliated with

Also associated with

Rating

Method of arranging solder balls for ball grid array packages does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of arranging solder balls for ball grid array packages, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of arranging solder balls for ball grid array packages will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4186075