Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
Reexamination Certificate
2007-01-18
2010-11-23
Smith, Zandra (Department: 2822)
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
Insulative material deposited upon semiconductive substrate
C438S791000
Reexamination Certificate
active
07838444
ABSTRACT:
A fabrication method of a semiconductor device includes forming a silicon nitride layer on a compound semiconductor layer with a plasma CVD method and selectively treating the compound semiconductor layer with use of the silicon nitride layer for a mask. The silicon nitride layer has a refraction index of less than 1.85. The compound semiconductor layer includes Ga.
REFERENCES:
patent: 5985771 (1999-11-01), Moore et al.
patent: 7291911 (2007-11-01), Usami
patent: 2005-317572 (2005-11-01), None
Eudyna Devices Inc.
Perkins Pamela E
Smith Zandra
Westerman Hattori Daniels & Adrian LLP
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