Methods of forming conductive interconnects

Details Methods of forming conductive interconnects Methods of forming conductive interconnects

2008-02-20

2010-10-26

Landau, Matthew C (Department: 2813)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S622000, C438S672000, C438S675000

Reexamination Certificate

active

07820545

ABSTRACT:
The invention includes methods of electroless plating of nickel selectively on exposed conductive surfaces relative to exposed insulative surfaces. The electroless plating can utilize a bath which contains triethanolamine, maleic anhydride and at least one nickel salt.

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Kondo et al. “Acceleration of Electroless Copper Deposition in the Presence of Excess Triethanolamine” The Electrochemical Society, Inc. © 1991, pp. 3629-3633.
D. Baudrand, “Electroless Nickel Plating Surface Engineering” ASM Handbook; vol. 5 pp. 290-310.

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