Thin film solar cell and its fabrication

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate

Reexamination Certificate

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C438S097000, C438S486000, C438S491000, C438S513000, C136S255000, C136S258000, C136S261000

Reexamination Certificate

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07838442

ABSTRACT:
A method for producing a solar cell including the steps of forming a p-type microcrystalline silicon oxide layer on a glass substrate using a PECVD method and raw gases comprising Silane gas, Diborane gas, Hydrogen gas and Carbon Dioxide gas. The method may employ a frequency of between about 13.56-60 MHz. The PECVD method may be performed at a power density of between about 10-40 mW/cm2and a pressure of between about 0.5-2 Torr, and with a ratio of Carbon Dioxide to Silane of between about 0.10-0.24; a ratio of Diborane to Silane of 0.10 or less, and a ratio of Silane to Hydrogen of 0.01 or less. A tandem solar cell structure may be formed by forming top and bottom layers by the method described above, and placing the top layer over the bottom layer.

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Barua et al., “Improvement in the conversion efficiency of single and doulbe junction a-Si solar cells by using high quality p-SiO:H window layer and seed layer/thin n-mc-Si:H bilayer”, IEEE 2000, pp. 829-830.
Sarker et al., “The Growth of Crystallinity in Undoped SiO:H Films at Low RF-Power Density and Substrate Temperature”, The Japan Society of Applied Physics, vol. 40 (2001), pp. L94-L96.

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