Integrated circuit underfill package system

Details Integrated circuit underfill package system Integrated circuit underfill package system

2008-12-16

2010-06-22

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With specified encapsulant

C257S787000, C257S696000, C257SE23133

Reexamination Certificate

active

07741726

ABSTRACT:
An integrated circuit underfill package system including providing a substrate having a dispense port, attaching a first integrated circuit die on the substrate, and supplying an underfill to the dispense port when the substrate and the first integrated circuit die are inverted.

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