Method for separately optimizing spacer width for two...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – Insulated gate formation

Reexamination Certificate

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C257SE21626, C257SE21640

Reexamination Certificate

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07820539

ABSTRACT:
A method for making a semiconductor device is provided. In accordance with the method, a semiconductor structure is provided which comprises (a) a substrate (203), (b) first (219) and second (220) gate electrodes disposed over the substrate, and (c) first (223) and second (225) sets of spacer structures disposed adjacent to said first and second gate electrodes, respectively. A first layer of photoresist (231) is disposed over the structure such that the first set of spacer structures is exposed and the second set of spacer structures is covered. The structure is then subjected to an etch which etches the first layer of photoresist and a portion of the first and second sets of spacer structures.

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