Apparatus and method for manufacturing semiconductor device

Details Apparatus and method for manufacturing semiconductor device Apparatus and method for manufacturing semiconductor device

2007-08-24

2010-12-14

Koch, III, George R (Department: 1791)

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Automatic and/or material-triggered control

C156S361000, C156S362000, C156S378000, C156S379000, C029S740000, C029S741000, C029S833000, C029S834000

Reexamination Certificate

active

07849897

ABSTRACT:
An apparatus for manufacturing a semiconductor device, includes: a collet; an alignment stage; and a sheet feeding mechanism. The collet is configured to suck a surface of a semiconductor chip. The surface is on opposite side of a bonding surface to be bonded to a bonding target. The bonding surface is provided with a film-like adhesive layer. The collet includes a heater for heating the adhesive layer. The alignment stage is configured to support the semiconductor chip and to correct position of the semiconductor chip. The sheet feeding mechanism is configured to feed a release sheet onto the alignment stage.

REFERENCES:
patent: 6571465 (2003-06-01), Shirakawa
patent: 2005/0081986 (2005-04-01), Kwon et al.
patent: 2000-252303 (2000-09-01), None
patent: 2005-123609 (2005-05-01), None

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