Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Patent
1993-01-29
1996-09-17
Crane, Sara W.
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
On insulating carrier other than a printed circuit board
257664, 257728, 333246, 333247, H01L 23495
Patent
active
055571441
ABSTRACT:
A plastic package for microwave applications up to 14 Ghz is disclosed. The plastic package includes a plastic platform, a lead frame embedded on the surface of the platform and, in one embodiment, a plastic cap mounted on the platform so as to seal the chip within the package. The lead frame includes a baseplate for mounting at least one semiconductor chip, at least one ground lead attached to the baseplate and extending outwardly therefrom, and at least one signal lead for conducting signals to or from such semiconductor chip. The signal lead and at least one ground lead are configured as a microwave transmission line such as microwave coplanar strips, or microwave coplanar waveguide for transmitting microwave frequency signals. The package offers a low inductance ground path, good thermal characteristics, and low parasitic inductance and capacitance. It can be applied for high speed and high frequency applications.
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Bayruns John T.
Gilbert George G.
Rosenstock Michael A.
Sanyigo Kenneth S.
Wallace Phillip W.
Anadigics Inc.
Arroyo T. M.
Crane Sara W.
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