Method for filling a trench in a semiconductor product

Details Method for filling a trench in a semiconductor product Method for filling a trench in a semiconductor product

2007-08-30

2009-12-29

Picardat, Kevin M (Department: 2822)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S626000, C438S631000, C438S633000

Reexamination Certificate

active

07638434

ABSTRACT:
Method for filling a trench in a semiconductor product is disclosed. A first material is deposited onto a semiconductor product having a surface in which at least one trench is formed. A first layer is formed within the trench and on the surface of the semiconductor product outside the trench. A second material is deposited to form a second layer above the first layer outside the trench and the trench is filled. Chemical mechanical polishing is performed so that the second layer is removed above the first layer outside the trench and whereby the first layer is at least uncovered outside the trench. Residual first material of the first layer is removed by wet-chemical etching.

REFERENCES:
patent: 6709979 (2004-03-01), Komai et al.
patent: 6743268 (2004-06-01), Cote et al.
patent: 6899597 (2005-05-01), Wrschka et al.
patent: 6953742 (2005-10-01), Chen et al.
patent: 7390429 (2008-06-01), Liu et al.
patent: 2003/0113996 (2003-06-01), Nogami et al.
patent: 2005/0077627 (2005-04-01), Yu et al.
patent: 2005/0153546 (2005-07-01), Ahrens et al.
patent: 2006/0008968 (2006-01-01), Brask et al.
patent: 2006/0113675 (2006-06-01), Chang et al.
patent: 2006/0134915 (2006-06-01), Hoang et al.
patent: 2006/0205204 (2006-09-01), Beck
patent: 10 2004 002 407 (2004-11-01), None
patent: 1020040043383 (2004-05-01), None

Affiliated with

Also associated with

Rating

Method for filling a trench in a semiconductor product does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for filling a trench in a semiconductor product, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for filling a trench in a semiconductor product will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4147450