Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate
2007-12-12
2009-06-23
Williams, Alexander O (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
C257SE23141, C257SE23069, C257SE23101, C257SE23178, C257SE25023, C257S737000, C257S778000, C257S734000, C257S673000, C257S698000, C257SE23021, C257S668000, C257SE23125, C257SE23124, C257SE23004, C257S773000, C257S700000, C257S701000, C257S703000
Reexamination Certificate
active
07550830
ABSTRACT:
Provided is a semiconductor package accomplishing a fan-out structure through wire bonding in which a pad of a semiconductor chip is connected to a printed circuit board through wire bonding. A semiconductor package can be produced without a molding process and can be easily stacked on another semiconductor package while the appearance cracks and the warpage defects can be prevented.
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Marger & Johnson & McCollom, P.C.
Samsung Electronics Co,. Ltd.
Williams Alexander O
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