Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2006-07-05
2009-06-09
Parekh, Nitin (Department: 2811)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S666000, C257S737000, C257SE23021
Reexamination Certificate
active
07544598
ABSTRACT:
A method of manufacturing a semiconductor device, including: providing a semiconductor substrate which has a plurality of electrodes and in which a depression is formed on a side on which the electrodes are formed; forming a resin protrusion on the semiconductor substrate so that part of the resin protrusion is positioned in the depression; and forming an interconnect on the resin protrusion, the interconnect being electrically connected to at least one of the electrodes.
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Oliff & Berridg,e PLC
Parekh Nitin
Seiko Epson Corporation
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