Method of manufacturing a semiconductor device

Details Method of manufacturing a semiconductor device Method of manufacturing a semiconductor device

2006-07-31

2009-12-15

Zarneke, David A (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Encapsulating

C438S126000, C264S272150, C264S272170, C264S275000, C425S125000, C425S127000, C257SE21502, C257SE21504

Reexamination Certificate

active

07632720

ABSTRACT:
In connection with a memory card of a block molding type there is provided a method able to prevent the occurrence of a chip crack in transfer molding. The method includes a first step wherein a substrate having plural chips constituting plural memory cards and mounted on a surface of the substrate and further having connecting terminals in recesses formed on a substrate surface opposite to the chips-mounted surface is sandwiched between a first die (upper die) installed on the chips-mounted surface side and a second die (lower die) installed on the surface side where the connecting terminal are formed. The method further includes a second step of injecting sealing resin between the first die and the substrate to seal at a time the plural chips mounted on the substrate. Projecting portions (terminal supporting elements) projecting from the surrounding portion are formed in regions of the second die which regions are positioned just under the connecting terminals. The projecting portions support the connecting terminals in the second step.

REFERENCES:
patent: 6114192 (2000-09-01), Tsunoda et al.
patent: 6333211 (2001-12-01), Sato et al.
patent: 6365432 (2002-04-01), Fukutomi et al.
patent: 6635209 (2003-10-01), Huang
patent: 2003-318210 (2003-11-01), None

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