Chip structure with bevel pad row

Details Chip structure with bevel pad row Chip structure with bevel pad row

2006-04-17

2009-02-03

Andújar, Leonardo (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Configuration or pattern of bonds

C257SE23079

Reexamination Certificate

active

07485974

ABSTRACT:
A chip structure with a bevel pad row comprises a substrate, a plurality of middle pad rows, and a bevel pad row. The substrate has an active surface including a middle wire bonding area and a corner wire bonding area. The middle wire bonding area is adjacent to a side of the active surface. The corner wire bonding area is adjacent to the side and a end of the middle wire bonding area, and the corner wire bonding area has a bevel edge with an acute incline angle to the side. The middle pad rows are disposed in the middle wire bonding area, and the bevel pad row is disposed along the bevel edge of the corner wire bonding area. The bevel pad row has a plurality of bevel pads, and the quantity of which is greater than that of the middle pad rows in the middle wire bonding area.

REFERENCES:
patent: 6921981 (2005-07-01), Tien

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