Diffused aerial image model semiconductor device fabrication

Details Diffused aerial image model semiconductor device fabrication Diffused aerial image model semiconductor device fabrication

2006-11-03

2009-08-04

Levin, Naum B (Department: 2825)

Computer-aided design and analysis of circuits and semiconductor

Nanotechnology related integrated circuit design

C716S030000, C716S030000, C703S002000, C430S270100, C430S325000, C438S780000

Reexamination Certificate

active

07571424

ABSTRACT:
A lithography method has a simulation method for mathematically approximating a photoresist film pattern with a Diffused Aerial Image Model (“DAIM”) for semiconductor device fabrication. The DAIM is applied with at least two acids having heterogeneous diffusion characteristics.

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