Methods for securing packaged semiconductor devices to...

Details Methods for securing packaged semiconductor devices to... Methods for securing packaged semiconductor devices to...

2005-09-01

2009-08-04

Coleman, W. David (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C257SE21499

Reexamination Certificate

active

07569418

ABSTRACT:
A method for securing a semiconductor device to a carrier substrate includes inserting a semiconductor device with a plurality of stub contacts extending from a bottom edge thereof into a receptacle of an alignment device associated with the carrier substrate. Upon attachment of the alignment device to a carrier substrate and insertion of a vertically mountable semiconductor device into the receptacle, the semiconductor device is biased so as to establish and maintain electrical communication between the semiconductor device and the carrier substrate.

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