Customized silicon chips produced using dynamically...

Electronic digital logic circuitry – Signal sensitivity or transmission integrity – Output switching noise reduction

Reexamination Certificate

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C326S041000

Reexamination Certificate

active

07598766

ABSTRACT:
A fabrication technique called “component and polymorphic network,” in which semiconductor chips are made from small prefabricated bare electronic component dies, e.g., application specific integrated circuits (ASICs), that are assembled according to designer specifications, and bonded to a semiconductor substrate comprising the polymorphic network. The component and polymorphic network assembly has a low overhead for producing custom chips. In another exemplary embodiment, the polymorphic network can be combined with functional components in a single die. The interconnect scheme for ports on the polymorphic network can be configured or reconfigured with configuration data prior to the runtime of an application, to achieve different interconnect schemes.

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