Substrate having alignment marks and method of obtaining...

Active solid-state devices (e.g. – transistors – solid-state diode – Alignment marks

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S401000, C438S462000, C257SE23179

Reexamination Certificate

active

07602072

ABSTRACT:
The alignment marks formed in a scribe line of a semiconductor substrate include at least one main mark, a first sub-mark and second sub-marks. The first sub-mark is formed at a central portion of the main mark. The second sub-marks are disposed symmetrically with respect to the first sub-mark and are used for detecting asymmetry of the main mark by measuring distances between respective side edges of the main mark and the first sub-mark, and by measuring respective side edges between the main mark and each of the second sub-marks. Alternatively, the alignment marks include main outer and inner marks and a sub-mark disposed in between the main outer and inner marks. In this case, the sub-mark is used for detecting asymmetry of the main mark by measuring distances between respective side edges of the main outer mark and the sub-mark, and by measuring respective side edges between the main inner mark and the sub-mark. Thus, accurate alignment information can be obtained regardless of whether the main mark was inadvertently formed as asymmetrical.

REFERENCES:
patent: 6172409 (2001-01-01), Zhou
patent: 6218200 (2001-04-01), Chen et al.
patent: 6801313 (2004-10-01), Yokota
patent: 7180593 (2007-02-01), Lin
patent: 7190823 (2007-03-01), Chen
patent: 7190824 (2007-03-01), Chen
patent: 7323393 (2008-01-01), Yen et al.
patent: 7449792 (2008-11-01), Yang et al.
patent: 2001/0033976 (2001-10-01), Soenosawa
patent: 2003/0053059 (2003-03-01), Mishima et al.
patent: 2003/0054574 (2003-03-01), Tanaka et al.
patent: 2003/0174879 (2003-09-01), Chen
patent: 1020020002926 (2002-01-01), None
patent: 1020020009880 (2002-02-01), None
patent: 0545204 (2006-01-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Substrate having alignment marks and method of obtaining... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Substrate having alignment marks and method of obtaining..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate having alignment marks and method of obtaining... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4137745

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.