Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2007-12-20
2009-11-10
Richards, N Drew (Department: 2895)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257SE23010
Reexamination Certificate
active
07615858
ABSTRACT:
A stacked-type semiconductor device package is provided. The stacked-type semiconductor device package includes a plurality of stacked semiconductor chip packages with joining electrodes exposed on sides of the semiconductor chip packages and a flexible printed circuit board (flexible PCB) on which the stacked semiconductor chip packages are mounted. The flexible PCB includes a first surface having connecting electrodes corresponding to the joining electrodes of the stacked semiconductor chip packages and a second surface opposite the first surface. The flexible PCB covers the sides of the stacked semiconductor chip packages, and the connecting electrodes of the first surface are connected to the joining electrodes of the stacked semiconductor chip packages.
REFERENCES:
patent: 5466634 (1995-11-01), Beilstein, Jr. et al.
patent: 6884654 (2005-04-01), King et al.
patent: 2003-017617 (2003-01-01), None
patent: 2003017617 (2003-01-01), None
patent: 2006-216692 (2006-08-01), None
patent: 2006-278975 (2006-10-01), None
patent: 2005-0048123 (2005-05-01), None
English language abstract of Japanese Publication No. 2003-017617.
Diallo Mamadou
Marger & Johnson & McCollom, P.C.
Richards N Drew
Samsung Electronics Co,. Ltd.
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