Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1990-07-19
1991-12-24
Pal, Asok
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
118725, 118667, 118719, 156613, 156614, 156DIG20, 156DIG70, 148 33, 427 38, 427 39, C23C 1422
Patent
active
050749544
ABSTRACT:
This invention relates to an improvement in a reduced gaseous phase growing method for compound semiconductor monocrystal formed from a plurality of elements such as GaAs.
A gas of compound containing each of constitutional elements is introduced into a reduced reaction pipe of which temperature distribution is controlled, without use of H.sub.2 or He as a carrier gas. Thereby it is possible to control the amount of introduction of each of the elements of the compound semiconductor subjected to epitaxial growth.
In addition, the temperature distribution within the reaction pipe is controlled and the temperature of the crystal substrate is maintained at a relatively low temperature to improve the quality of the growing crystal.
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patent: 4636401 (1987-01-01), Yamazaki et al.
J. W. Matthews, "Epitaxial Growth, Part A", Academic Press (1975), pp. 102-107.
Nishizawa Junichi
Pal Asok
Research Development Corporation
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