Photoresist undercoat-forming material and patterning process

Details Photoresist undercoat-forming material and patterning process Photoresist undercoat-forming material and patterning process

2007-05-10

2009-12-15

Lee, Sin J. (Department: 1795)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

C430S270100, C430S323000, C430S326000, C528S129000, C528S153000

Reexamination Certificate

active

07632624

ABSTRACT:
A material comprising a specific bisphenol compound of formula (1) is useful in forming a photoresist undercoat wherein R1and R2are H, alkyl, aryl or alkenyl, R3and R4are H, alkyl, alkenyl, aryl, acetal, acyl or glycidyl, R5and R6are alkyl having a ring structure, or R5and R6bond together to form a ring. The undercoat-forming material has an extinction coefficient sufficient to provide an antireflective effect at a thickness of at least 200 nm, and a high etching resistance as demonstrated by slow etching rates with CF4/CHF3and Cl2/BCl3gases for substrate processing.

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