Small electrode for phase change memories

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S675000, C438S947000, C257SE21206

Reexamination Certificate

active

07494922

ABSTRACT:
A method of manufacturing a memory cell is disclosed. In one embodiment, the method includes forming an electrode including an outer surface that is substantially circular and an exposed surface that has a sublithographic dimension in a direction parallel to the exposed surface. Further, the method may also include forming a layer of phase change material coupled to the exposed surface of the electrode. Various semiconductor devices and additional methods of manufacturing memory cells are also provided.

REFERENCES:
patent: 3241009 (1966-03-01), Dewald et al.
patent: 3423646 (1969-01-01), Cubert et al.
patent: 3602635 (1971-08-01), Romankiw
patent: 3699543 (1972-10-01), Neale
patent: 3796926 (1974-03-01), Cole et al.
patent: 3877049 (1975-04-01), Buckley
patent: 3886577 (1975-05-01), Buckley
patent: 4099260 (1978-07-01), Lynes et al.
patent: 4115872 (1978-09-01), Bluhm
patent: 4174521 (1979-11-01), Neale
patent: 4194283 (1980-03-01), Hoffmann
patent: 4203123 (1980-05-01), Shanks
patent: 4227297 (1980-10-01), Angerstein
patent: 4272562 (1981-06-01), Wood
patent: 4420766 (1983-12-01), Kasten
patent: 4433342 (1984-02-01), Patel et al.
patent: 4458260 (1984-07-01), McIntyre et al.
patent: 4499557 (1985-02-01), Holmberg et al.
patent: 4502208 (1985-03-01), McPherson
patent: 4502914 (1985-03-01), Trumpp et al.
patent: 4569698 (1986-02-01), Feist
patent: 4630355 (1986-12-01), Johnson
patent: 4641420 (1987-02-01), Lee
patent: 4642140 (1987-02-01), Noufi et al.
patent: 4666252 (1987-05-01), Yaniv et al.
patent: 4677742 (1987-07-01), Johnson
patent: 4757359 (1988-07-01), Chiao et al.
patent: 4795657 (1989-01-01), Formigoni et al.
patent: 4804490 (1989-02-01), Pryor et al.
patent: 4809044 (1989-02-01), Pryor et al.
patent: 4823181 (1989-04-01), Mohsen et al.
patent: 4876220 (1989-10-01), Mohsen et al.
patent: 4876668 (1989-10-01), Thakoor et al.
patent: 4881114 (1989-11-01), Mohsen et al.
patent: 4892840 (1990-01-01), Esquivel et al.
patent: 4956312 (1990-09-01), Van Laarhoven
patent: 5144404 (1992-09-01), Iranmanesh et al.
patent: 5166096 (1992-11-01), Cote et al.
patent: 5166758 (1992-11-01), Ovshinsky et al.
patent: 5177567 (1993-01-01), Klersy et al.
patent: 5216282 (1993-06-01), Cote et al.
patent: 5223448 (1993-06-01), Su
patent: 5233217 (1993-08-01), Dixit et al.
patent: 5278099 (1994-01-01), Maeda
patent: 5293335 (1994-03-01), Pernisz et al.
patent: 5296716 (1994-03-01), Ovshinsky et al.
patent: 5310693 (1994-05-01), Hsue
patent: 5335219 (1994-08-01), Ovshinsky et al.
patent: 5341328 (1994-08-01), Ovshinsky et al.
patent: 5359205 (1994-10-01), Ovshinsky
patent: 5363329 (1994-11-01), Troyan
patent: 5406125 (1995-04-01), Johnson et al.
patent: 5414221 (1995-05-01), Gardner
patent: 5414271 (1995-05-01), Ovshinsky et al.
patent: 5429988 (1995-07-01), Huang et al.
patent: 5466637 (1995-11-01), Kim
patent: 5500080 (1996-03-01), Choi
patent: 5510629 (1996-04-01), Karpovich et al.
patent: 5529956 (1996-06-01), Morishita
patent: 5534711 (1996-07-01), Ovshinsky et al.
patent: 5534712 (1996-07-01), Ovshinsky et al.
patent: 5536947 (1996-07-01), Klersy et al.
patent: 5569932 (1996-10-01), Shor et al.
patent: 5578185 (1996-11-01), Bergeron et al.
patent: 5614765 (1997-03-01), Avanzino et al.
patent: 5648298 (1997-07-01), Cho
patent: 5665625 (1997-09-01), Sandhu et al.
patent: 5675187 (1997-10-01), Numata et al.
patent: 5677242 (1997-10-01), Aisou
patent: 5687112 (1997-11-01), Ovshinsky
patent: 5705430 (1998-01-01), Avanzino et al.
patent: 5714768 (1998-02-01), Ovshinsky et al.
patent: 5714795 (1998-02-01), Ohmi et al.
patent: 5719089 (1998-02-01), Cherng et al.
patent: 5728596 (1998-03-01), Prall
patent: 5751012 (1998-05-01), Wolstenholme et al.
patent: 5789277 (1998-08-01), Zahorik et al.
patent: 5789758 (1998-08-01), Reinberg
patent: 5814527 (1998-09-01), Wolstenholme et al.
patent: 5831276 (1998-11-01), Gonzalez et al.
patent: 5841150 (1998-11-01), Gonzalez et al.
patent: 5847460 (1998-12-01), Liou et al.
patent: 5869843 (1999-02-01), Harshfield
patent: 5874359 (1999-02-01), Liaw et al.
patent: 5920788 (1999-07-01), Reinberg
patent: 6077729 (2000-06-01), Harshfield
patent: 6111319 (2000-08-01), Liou et al.
patent: 6117720 (2000-09-01), Harshfield
patent: 6337266 (2002-01-01), Zahorik
patent: 6420725 (2002-07-01), Harshfield
patent: 6531391 (2003-03-01), Zahorik
patent: 6635951 (2003-10-01), Zahorik
patent: 6797612 (2004-09-01), Zahorik
patent: 7273809 (2007-09-01), Zahorik
patent: 0 117 045 (1984-08-01), None
patent: 1 319 388 (1973-06-01), None
patent: 60109266 (1985-06-01), None
Kim and Kim, “Effects of High-Current Pulses on Polycrystalline Silicon Diode with n-type Region Heavily Doped with Both Boron and Phosphorus,”J. Appl. Phys., 53(7):5359-5360, Jul. 1982.
Neale and Aseltine, “The Application of Amorphous Materials to Computer Memories,”IEEE Transactions on Election Devices, 20(2):195-205, Feb. 1973.
Pein and Plummer, “Performance of the 3-D Sidewall Flash EPROM Cell,”International Electron Devices Meeting, , Dec. 11-14, 1993.
Post and Ashburn, “Investigation of Boron Diffusion in Polysilicon and its Application to the Design of p-n-p Polysilicon Emitter Bipolar Transistors with Shallow Emitter Junctions,”IEEE Transactions on Electron Devices, 38(11):2442-2451, Nov. 1991.
Post et al., “Polysilicon Emitters for Bipolar Transistors: A Review and Re-Evaluation of Theory and Experiment,”IEEE Transactions on Electron Devices, 39(7):1717-1731, Jul. 1992.
Post and Ashburn, “The Use of an Interface Anneal to Control the Base Current and Emitter Resistance of p-n-p Polysilicon Emitter Bipolar Transistors,”IEEE Electron Device Letters, 13(8):408-410 Aug. 1992.
Rose et al., “Amorphous Silicon Analogue Memory Devices,”J. Non-Crystalline Solids, 115:168-170, 1989.
Schaber et al., “Laser Annealing Study of the Grain Size Effect in Polycrystalline Silicon Schottky Diodes,”J. Appl. Phys., 53(12):8827-8834, Dec. 1982.
Yamamoto et al., “The I-V Characteristics of Polycrystalline Silicon Diodes and the Energy Distribution of Traps in Grain Boundaries,”Electronics and Communications in Japan, Part 2, 75(7):51-58, 1992.
Yeh et al., “Investigation of Thermal Coefficient Polycrystalline Silicon Thermal Sensor Diode,”Jpn. J. Appl. Phys., 31(Part 1, No. 2A):151-155, Feb. 1992.
Oakley et al., “Pillars—The Way to Two Micron Pitch Multilevel Metallisation,”IEEE, 23-29, 1984.
Prince, “Semiconductor Memories,” A Handbook of Design, Manufacture, and Application, 2ndEd., Wiley, pp. 118-123, 1991.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Small electrode for phase change memories does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Small electrode for phase change memories, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Small electrode for phase change memories will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4128917

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.