Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2007-09-28
2009-10-20
Tugbang, A. Dexter (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S883000, C029S858000, C264S272110, C264S272150, C264S275000
Reexamination Certificate
active
07603770
ABSTRACT:
An electronic assembly including a vertical mount connector header is overmolded to form an encapsulated module. Conductor pins retained in the connector header are coupled to a circuit board to support the connector header with respect to the circuit board, leaving an open space between the connector header and the circuit board. The electronic assembly is then placed in a mold for plastic encapsulation. The floor of the mold has a well sized to accommodate the conductor pins and shroud of the connector header, and the connector header has a peripheral flange that seats against the floor of the mold to keep encapsulant out of the well. Encapsulant fills open spaces inboard of the connector header, and a connector insert disposed between the connector header and the floor of the well prevents distention of the connector header and circuit board due to the packing pressure of the encapsulant.
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Brandenburg Scott D.
Laudick David A.
Angwin David P
Delphi Technologies Inc.
Funke Jimmy L.
Tugbang A. Dexter
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