Method of manufacturing for conductive pattern substrate

Details Method of manufacturing for conductive pattern substrate Method of manufacturing for conductive pattern substrate

2003-04-17

2009-08-04

Huff, Mark F (Department: 1795)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making named article

C430S322000, C430S315000, C430S324000, C430S302000, C430S330000

Reexamination Certificate

active

07569334

ABSTRACT:
In the present invention, the problem of stability deterioration of the obtained conductive pattern substrate at the time of forming a conductive pattern by an additive method when a layer having reactivity remains on the substrate is to be solved. According to pattern exposure with a photo catalyst substrate4having a photo catalyst layer3laminated on a second substrate5superimposed onto a wettability changeable substrate1with a wettability changeable layer3laminated on a first substrate2,a wettability pattern is formed. And furthermore, by adhering a conductive coating solution, or the like, a conductive pattern substrate without containing a photo catalyst can be manufactured.

REFERENCES:
patent: 4594182 (1986-06-01), Hashimoto et al.
patent: 2003/0087073 (2003-05-01), Kobayashi
patent: 2004/0027514 (2004-02-01), Kobayashi et al.
patent: 2000-249821 (2000-09-01), None
patent: 2001-345537 (2001-12-01), None
English translation of JP 2000-249821, “Production of Patten Formed Body”, Kobayashi et al., Sep. 2000.

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