Semiconductor device

Details Semiconductor device Semiconductor device

2006-10-16

2009-11-17

Stoner, Kiley (Department: 1793)

Metal fusion bonding

Process

Plural joints

C257S784000

Reexamination Certificate

active

07617966

ABSTRACT:
A wire bonding method that connects a first bonding point and a second bonding point by a wire, the method including a step that press-bonds a ball formed on a tip end of a wire to a first bonding point, thus forming a press-bonded ball; a step that slightly raises a capillary, moves the capillary toward a second bonding point and then lowers the capillary by an amount that is smaller than an amount in which the capillary was raised, and a step that raises the capillary to allow the wire to be paid out of the capillary and moves the capillary toward a second bonding point, thus connecting the wire to the second bonding point.

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patent: 10-189641 (1998-07-01), None

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