Method of stacking and interconnecting semiconductor...

Details Method of stacking and interconnecting semiconductor... Method of stacking and interconnecting semiconductor...

2006-06-29

2009-11-10

Vu, Hung (Department: 2811)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S109000, C438S127000, C438S459000, C438S977000

Reexamination Certificate

active

07615409

ABSTRACT:
An electronic component is disclosed including a plurality of stacked semiconductor packages. A first such embodiment includes an internal connector for electrically coupling the stacked semiconductor packages. A second such embodiment includes an external connector for electrically coupling the stacked semiconductor packages.

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