Drying and gas or vapor contact with solids – Process – By centrifugal force
Reexamination Certificate
2002-12-18
2009-10-06
Lu, Jiping (Department: 3743)
Drying and gas or vapor contact with solids
Process
By centrifugal force
C034S339000, C034S357000, C034S058000, C134S148000, C134S153000, C134S186000, C134S902000
Reexamination Certificate
active
07596886
ABSTRACT:
In one embodiment of the invention, an apparatus for collecting fluid within a wafer cleaning chamber is provided. The apparatus includes a rotatable annular manifold configured to support a wafer within an inner cavity defined by an inner surface of the annular manifold. The annular manifold includes a channel extending from an inner surface of the annular manifold to a floor of the annular manifold. The floor has at least one opening. The apparatus includes a catch basin having a base with at least one drain. The base has an inner sidewall and an outer sidewall extending therefrom. The catch basin is disposed under the annular manifold to capture fluid dispensed from the at least one opening of the floor of the annular manifold. A spin, rinse and dry module and a method for collecting a fluid delivered to the surface of a rotating wafer are provided.
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Boyd John M.
Redeker Fred C.
Lam Research Corporation
Lu Jiping
Martine & Penilla & Gencarella LLP
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