Dicing die adhesive film for semiconductor

Details Dicing die adhesive film for semiconductor Dicing die adhesive film for semiconductor

2006-04-27

2009-02-03

Clark, S. V (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S118000, C257S783000

Reexamination Certificate

active

07485494

ABSTRACT:
A dicing die adhesive film for semiconductor of the present invention has a 3-layered structure including a first adhesive layer attached on the back of a semiconductor wafer; a second adhesive layer attached onto the first adhesive layer; and a dicing film attached onto the second adhesive layer, and therefore has an advantage that it can ensure reliability of the semiconductor packaging process since it may prevent the die-flying phenomenon and the poor pickup of the die in the dicing process and maintain a sufficient adhesive force between the die and the substrate upon die boding.

REFERENCES:
patent: 2005/0215032 (2005-09-01), Seo et al.
patent: 2006/0226520 (2006-10-01), Yoshimura et al.
patent: 2007/0015342 (2007-01-01), Abe
patent: 2007/0117259 (2007-05-01), Anderson et al.
patent: 2007/0120271 (2007-05-01), Kozakai et al.
patent: 2007/0134846 (2007-06-01), Takahashi et al.

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