Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Including adhesive bonding step
Inventor
active
Dicing die adhesive film for semiconductor
Semiconductor packaging method
Squeeze for screen printer
No associations
LandOfFree
Joon-Mo Seo does not yet have a rating. At this time, there are no reviews or comments for this inventor.
If you have personal experience with Joon-Mo Seo, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Joon-Mo Seo will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-P-3189058