Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2005-08-04
2009-02-24
Dang, Phuc T (Department: 2892)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C257S686000, C257S737000, C361S735000, C361S736000
Reexamination Certificate
active
07495334
ABSTRACT:
The present invention stacks chip scale-packaged integrated circuits (CSPs) into modules that conserve PWB or other board surface area. In a two-high CSP stack or module devised in accordance with a preferred embodiment of the present invention, two CSPs are stacked, with one CSP disposed above the other. The two CSPs are connected with flex circuitry. A form standard is disposed between the flex circuitry and a CSP in the stack. The form standard can take many configurations and may be used where flex circuits are used to connect CSPs to one another in stacked modules having two or more constituent CSPs. For example, in stacked modules that include four CSPs, three form standards are employed in preferred embodiments, although fewer may be used. The form standard provides a thermally conductive physical form that allows many of the varying package sizes found in the broad family of CSP packages to be used to advantage while employing a standard connective flex circuitry design.
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Buchle Jeff
Cady James W.
Dowden Julian
Rapport Russell
Roper David L.
Dang Phuc T
Entorian Technologies LP
Fish & Richardson P.C.
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